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Xiaomi’s XRING 03 Goes Official On TSMC’s 3nm N3P Process, Sports 24 Billion Transistors, First Smartphone SoC To Support LPDDR6 RAM, All-Big-Core CPU Design & More - Wccftech

Published by Wccftech By Omar Sohail · 24 August 2026 at 13:58
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Xiaomi’s XRING 03 Goes Official On TSMC’s 3nm N3P Process, Sports 24 Billion Transistors, First Smartphone SoC To Support LPDDR6 RAM, All-Big-Core CPU Design & More - Wccftech
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What the report says

Xiaomi officially unveils the XRING 03 flagship SoC featuring TSMC 3nm N3P node 24 billion transistors LPDDR6 memory support and a 10 core CPU architecture

Read the full report at Wccftech →

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